Dimensity 8100 AnTuTu, GeekBench, 3DMark, Benchmarks

About
GeekBench Scores
AnTuTu Scores
3DMark Scores
Phones
Full Specifications
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About

MediaTek Dimensity 8100 is a 5G chipset, launched on February 24^th 2022.
Xiaomi Redmi K50 5G is the world’s first smartphone, powered by the 5nm based MediaTek Dimensity 8100 processor.

Dimensity 8100 GeekBench Scores
Single Core	926
Multi Core	3630

Dimensity 8100 GeekBench Scores

Dimensity 8100 AnTuTu Scores
Total	809560
CPU	188106
GPU	313493
MEM	142960
UX	165001

Dimensity 8100 AnTuTu Scores

Dimensity 8100 3DMark Scores
OpenGL	8642
Vulkan	6930

Dimensity 8100 Mobiles

Brands	Phones
Xiaomi	Redmi K50
Realme	Realme GT Neo 3

MediaTek Dimensity 8100 Specifications

MediaTek Dimensity 8100 Processor
Launch Dt	24/02/2022
Model No	Dimensity 8100 RMX3562
Fabrication	5nm (nanometer) TSMC N5
CPU	CPU Architecture: 64-bit CPU Clock Speed: Up to 2.85GHz CPU Cores: Octa-core 4xSuper Cores: 4xArm Cortex-A78 up to 2.85GHz 4xEfficiency Cores: 4xArm Cortex-A55 up to 2.0GHz
GPU	Arm Mali-G610 MC6 MediaTek HyperEngine 5.0 Gaming Technology
AI	MediaTek APU 580 (5th generation APU)
ISP	Powerful 5Gpixel/s
RAM	Type: LPDDR5 Speed: Up to 6.4Gbps Memory: Up to 16GB
Storage	Type: UFS 3.1 Speed: Up to 1.7 GB/s
Display	Max Mobile Display Support: WQHD+ @ 120HZ, Full HD+ @ 168Hz Display Support: MediaTek Intelligent Display Sync 2.0
Camera	Single Camera: Up to 200 MP @ 30FPS Dual Camera: Up to 64 MP + 64 MP @ 30FPS MediaTek Imagiq 780
Video	Video Recording: Up to 4K @60 FPS Recording Format: HEVC, VP-9, AV1, H.264, HEVC
Charging	Quick Charge Support
Cellular Modem	5G Carrier Aggregation Support: (2CC FDD/TDD) Multi-SIM Support: Global 5G multi-SIM (5G SA + 5G SA) 5G Upload Speed: Up to 2.5 Gbps 5G Download Speed: Up to 4.7 Gbps
Wi-Fi	Wi-Fi Standards: Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, 802.11a/b/g/n/ac/ax
Bluetooth	Bluetooth Version: Bluetooth 5.3
NFC	Near Field Communications: Supported
USB	USB Version: USB 3.1, USB-C
Location	Satellite Systems Support: GPS L1CA + L5, Galileo E1 + E5a, QZSS L1CA + L5, NavIC, BeiDou B1I + B2a + B1C, Glonass L1OF
Audio	Audio Technology: Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio