Table Of Contents
- About
- GeekBench Scores
- AnTuTu Scores
- 3DMark Scores
- Phones
- Full Specifications
- Other Chipset Comparison​s
About
- MediaTek Dimensity 700 is a 5G chipset, launched on March 14th 2021.
- Realme 8 5G is the world’s first smartphone, powered by the 7nm based MediaTek Dimensity 700 processor.
Dimensity 700 GeekBench Scores | |
---|---|
Single Core | 564 |
Multi Core | 1729 |
Dimensity 700 GeekBench Scores
Dimensity 700 AnTuTu Scores | |
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Total | 330132 |
CPU | 96205 |
GPU | 72050 |
MEM | 68991 |
UX | 92886 |
Dimensity 700 AnTuTu Scores
Dimensity 700 3DMark Scores | |
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OpenGL | 2459 |
Vulkan | 2247 |
Dimensity 700 Mobiles
MediaTek Dimensity 700 Specifications
MediaTek Dimensity 700 Processor | |
---|---|
Launch Dt | 14/03/2021 |
Model No | Dimensity 700 MT6833V/ZA |
Fabrication | 7nm (nanometer) |
CPU | CPU Architecture: 64-bit CPU Clock Speed: Up to 2.2GHz CPU Cores: Octa-core 2xSuper Cores: 2xArm Cortex-A76 up to 2.2GHz 6xEfficiency Cores: 6xArm Cortex-A55 up to 2GHz |
GPU | Arm Mali-G57 MC2 MediaTek HyperEngine 2.0 Gaming Technology |
AI | MediaTek APU 3.0 |
ISP | Powerful 2-Core |
RAM | Type: LPDDR4X up to 2133 MHz Memory: Up to 12GB |
Storage | Type: UFS 2.2 |
Display | Max Mobile Display Support: Full HD+ @ 90Hz Display Support: MediaTek MiraVision HDR, HDR 10+ |
Camera | Single Camera: Up to 64 MP @ 30FPS Dual Camera: Up to 16 MP + 16 MP @ 30FPS MediaTek Imagiq photography, videography |
Video | Video Recording: Up to 2K @ 30 FPS Recording Format: HEVC, VP9, H.264, H.265 |
Charging | Quick Charge Support |
Cellular Modem | 5G Carrier Aggregation Support: (2CC FDD/TDD) Multi-SIM Support: Global 5G multi-SIM (5G SA + 5G SA) 5G Download Speed: Up to 2.7 Gbps |
Wi-Fi | Wi-Fi Standards: Wi-Fi 5 802.11a/b/g/n/ac |
Bluetooth | Bluetooth Version: Bluetooth 5.1 |
NFC | Near Field Communications: Supported |
USB | USB Version: USB 3.1, USB-C |
Location | Satellite Systems Support: Glonass L1OF, Galileo E1 + E5a, QZSS L1CA+ L5, GPS L1CA+L5, BeiDou B1I+ B2a, NavIC |